News

Knowledge

Company News

Application Mind Map

Test Report

Technical Article

Industry News

Product Recommendation: 10EO-BPADMA (Ethoxylated Bisphenol A Dimethacrylate)

Release time:

2025-04-25 09:42

Product Recommendation: 10EO-BPADMA (Ethoxylated Bisphenol A Dimethacrylate)

Introduction

Ethoxylated bisphenol A dimethylacrylate (10EO-BPADMA) is an active monomer used in the field of light-curing applications. It is primarily synthesized by modifying bisphenol A through ethoxylation and esterification reactions. 10EO-BPADMA combines the rigid structure of the benzene ring with flexible chain segments (the ethoxylated structure), while also featuring highly reactive methacrylate groups. It boasts advantages such as high reactivity, excellent mechanical properties, and outstanding chemical stability.

Structural formula

Basic Data Reference

The difference from 10EO-BPADA

Structural differences: Compared to 10EO-BPADA, 10EO-BPADMA has two additional methyl (-CH3) groups. Due to steric hindrance caused by the nearby methyl groups, the double bond in the methacrylate moiety of 10EO-BPADMA exhibits a slower free-radical polymerization rate than that of 10EO-BPADA. However, the resulting polymer crosslinking network is more stable, and the shrinkage during curing is slightly lower than that of 10EO-BPADA, making 10EO-BPADMA particularly suitable for preparing high-precision optical or electronic materials. In contrast, the acrylate double bond in 10EO-BPADA displays higher reactivity and faster curing speed, thus making it more appropriate for UV-curable materials that require rapid molding.

Use Case Recommendations

(1) 3D printing
10EO-BPADMA features a rigid bisphenol A backbone combined with flexible ethoxy segments, enabling it to form a structure that exhibits both high strength and toughness. Meanwhile, the ethoxylated segments impart flexibility and processing fluidity to the material. Additionally, the presence of methacrylate double bonds at both ends makes this material suitable for photopolymerization-based 3D printing. This well-balanced molecular design—combining rigidity and flexibility—helps the material achieve an optimal balance between interlayer adhesion and resistance to deformation during the printing process.
(2) UV Coatings
10EO-BPADMA contains two methacrylate double bonds that can participate in photocuring. At the same time, it has a moderate viscosity, making it suitable as an active diluent in coating formulations. It provides excellent adhesion and durability while also enhancing the flexibility and chemical resistance of the coating. The rigid benzene ring structure in 10EO-BPADMA imparts properties such as high hardness and heat resistance to the material. Increasing the degree of ethoxylation can enhance the hydrophilicity of the coating, thereby improving its wettability and leveling on polar substrates and reducing surface defects such as orange peel and craters.
(3) High-temperature resistant anaerobic adhesive
The heat resistance temperature of general-purpose anaerobic adhesives typically ranges around 150℃; therefore, the substances used in this formulation must possess high-temperature resistance. The main chain of 10EO-BPADMA contains a benzene ring structure and exhibits conjugation. Moreover, the spatial structural characteristics of the benzene ring help enhance the cross-linking density of the polymer, thereby imparting excellent heat resistance and making it suitable for use in high-temperature-resistant anaerobic adhesives.
(4) Photosensitive Dry Film
The bisphenol A structure (benzene ring) in 10EO-BPADMA exhibits excellent hydrophobicity and rigidity, while the ethoxy group imparts appropriate hydrophilicity, flexibility, and low shrinkage to the material, enabling it to meet the manufacturing requirements of high-density printed circuit boards and reducing the risk of trace breakage during handling or processing. When used in combination with alkali-soluble resins (which provide film-forming properties and adhesion), 10EO-BPADMA can adjust the balance between hydrophilicity and hydrophobicity within the system, optimize the permeability of the developer solution, and thus achieve rapid resist removal with no residue.
(5) Optical Materials
The bisphenol A skeleton in 10EO-BPADMA features an aromatic ring structure, which provides a high refractive index (typically above 1.54), making it suitable for high-refractive-index optical materials such as eyeglass lenses and optical films. The ethoxylated monomer can significantly reduce the shrinkage during curing, thereby minimizing the risk of deformation in optical components (such as lenses and waveguides) and ensuring excellent dimensional stability of the material.

Share to:

Application of UV Resins in Wood and Building Material Coatings

Product Recommendation: BM3384 (3PO-GPTA)