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BM2101M: Bis(2-ethoxy)bisphenol A dimethyl acrylate (10EO-BPADMA)
Release time:
2026-07-11 10:38
Product Overview
High photosensitivity, low shrinkage, and excellent mechanical properties.
1
Introduction
10EO‑BPADMA is an ethoxylated bisphenol A dimethacrylate with a high degree of ethoxylation, low skin irritation, rapid curing, and low shrinkage. It exhibits excellent mechanical strength, heat resistance, and chemical stability. When appropriately incorporated into formulations, it can mitigate shrinkage, enhance chemical resistance, and improve toughness.
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Molecular structural formula
3
Basic Parameters
Note: When using dry film on PCBs, the concentration of the polymerization inhibitor MEHQ should be maintained at 100–150 ppm.
4
Comprehensive Performance Comparison
Note:
Dilution Capability Test Method: A 1:1 mixture of standard bisphenol A diacrylate B‑100 and the 10EO‑BPADMA monomer is prepared, and its viscosity at 25°C is measured.
Formula 1: 10EO-BPADMA + 2 wt% 1173
Formula No. 2: B-113 20 g / 10EO-BPADMA 80 g / Active amine 2 g / Initiator 1173 2 g / Leveling agent 0.5 g
Formula 3: B-296 20g / 10EO-BPADMA 80g / 1173 2g
Formula Four: B-296 70 g / 10EO-BPADMA 30 g / 1173 3 g
Comparison results:
Through comprehensive comparative testing and validation—covering fundamental parameters (viscosity, appearance, color shade, refractive index, inhibitor content, etc.), compositional structure, UV‑curing performance (curing speed, yellowing of the coating, curing shrinkage), mechanical properties, adhesion, and resistance to boiling water—the 10EO‑BPADMA independently developed and manufactured by Boxing has achieved performance levels essentially comparable to those of commercially available products in key metrics such as molecular structure, curing rate, adhesion, curing shrinkage, and mechanical properties.
5
Recommended Use Cases
(1) Photosensitive Dry Film
In photosensitive dry film systems, the rigid benzene ring backbone of 10EO‑BPADMA imparts excellent hydrophobicity and dimensional stability, while the ethoxy side chains confer moderate hydrophilicity, flexibility, and low shrinkage. This balanced rigid–flexible architecture enables the material to meet the demanding requirements of high‑density circuit board fabrication, reducing the risk of pattern breakage during handling or processing. When combined with an alkali‑soluble resin—providing film‑forming properties and adhesion—10EO‑BPADMA precisely tunes the system’s hydrophilic–hydrophobic balance, optimizing developer penetration to achieve rapid resist stripping with no residue.
(2) 3D printing
10EO‑BPADMA combines the rigid backbone of bisphenol A with the flexible ethoxy segments, enabling it to form a high‑strength, highly tough three‑dimensional network upon photopolymerization. The ethoxy chains confer excellent processability and interlayer adhesion, while the methacrylate double bonds at both ends ensure high photopolymerization reactivity. This “rigid–flexible” molecular design allows the material, during stereolithography (SLA) and digital light processing (DLP) additive manufacturing, to maintain dimensional stability while effectively mitigating interlayer stresses, thereby reducing warping and cracking. Moreover, its low shrinkage facilitates the production of dimensionally accurate parts, such as those required for 3D‑printed jewelry casting.
(3) UV Coatings
As a reactive diluent, 10EO‑BPADMA features two methacrylate double bonds that participate in photopolymerization; it not only exhibits moderate viscosity, helping to reduce formulation viscosity, but also delivers excellent adhesion, abrasion resistance, and chemical resistance. The rigid bisphenol A structure imparts high hardness and heat resistance to the coating, while the ethoxy chain segments enhance flexibility and improve wetting on polar substrates, effectively minimizing surface defects such as orange peel and craters.
(4) Optical Materials
The bisphenol A aromatic ring structure of 10EO‑BPADMA imparts a high refractive index, making it suitable for high‑index optical materials such as eyeglass lenses and optical films. The introduction of ethoxy side chains significantly reduces curing shrinkage, thereby minimizing the risk of deformation in optical components and ensuring excellent dimensional stability and optical precision.
(5) Gel polish
Adding 10EO‑BPADMA can significantly enhance the pigment wetting performance of systems such as gel polish and colored gel, primarily due to its unique molecular structure, which effectively reduces interfacial tension between the pigment and the resin matrix. This facilitates better wetting and dispersion of pigment particles, ensuring uniform and stable coloration. Meanwhile, 10EO‑BPADMA also improves the leveling properties of the system, enabling the gel polish to spread more evenly during application and delivering higher color saturation and a more lustrous surface finish upon curing.
(6) Membrane material
10EO‑BPADMA, with its unique molecular structure, can be employed in privacy‑protecting films and excimer‑based skin‑feel coatings. In privacy‑filter systems, it effectively wets and disperses fillers, enhancing coating leveling and laying the groundwork for a uniform, defect‑free optical microstructure layer. For excimer skin‑feel coatings, it promotes the formation of an overall homogeneous microsurface with a delicately smooth tactile feel. The core value of 10EO‑BPADMA lies in its distinctive molecular architecture, which improves processability—such as dispersion and flow—and optimizes coating uniformity, offering an effective solution for enhancing the quality and performance of functional film materials.
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